Acoustic wave resonator RF filter circuit and system

ABSTRACT

An RF filter system including a plurality of BAW resonators arranged in a circuit, the circuit including a serial configuration of resonators and a parallel shunt configuration of resonators, the circuit having a circuit response corresponding to the serial configuration and the parallel configuration of the plurality of bulk acoustic wave resonators including a transmission loss from a pass band having a bandwidth from 5.490 GHz to 5.835 GHz. Resonators include a support member with a multilayer reflector structure; a first electrode including tungsten; a piezoelectric film including aluminum scandium nitride; a second electrode including tungsten; and a passivation layer including silicon nitride. At least one resonator includes at least a portion of the first electrode located within a cavity region defined by a surface of the support member.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application claims priority to and is a continuation of U.S.patent application Ser. No. 16/391,191 filed Apr. 22, 2019, acontinuation-in-part application of U.S. patent application Ser. No.16/290,703, filed Mar. 1, 2019, now U.S. Pat. No. 10,979,026, which is acontinuation-in-part application of U.S. patent application Ser. No.16/175,650, filed Oct. 30, 2018, now U.S. Pat. No. 10,979,025, which isa continuation-in-part application of U.S. patent application Ser. No.16/019,267 filed Jun. 26, 2018, now U.S. Pat. No. 10,979,022, which is acontinuation-in-part application of U.S. patent application Ser. No.15/784,919 filed Oct. 16, 2017, now U.S. Pat. No. 10,355,659, which is acontinuation-in-part application of U.S. Pat. application Ser. No.15/068,510 filed Mar. 11, 2016, now U.S. Pat. No. 10,217,930.

The present application incorporates by reference, for all purposes, thefollowing patent applications, all commonly owned: U.S. patentapplication Ser. No. 14/298,057, titled “RESONANCE CIRCUIT WITH A SINGLECRYSTAL CAPACITOR DIELECTRIC MATERIAL”, filed Jun. 2, 2014; U.S. patentapplication Ser. No. 14/298,076, titled “METHOD OF MANUFACTURE FORSINGLE CRYSTAL CAPACITOR DIELECTRIC FOR A RESONANCE CIRCUIT”, filed Jun.2, 2014; U.S. patent application Ser. No. 14/298,100, titled “INTEGRATEDCIRCUIT CONFIGURED WITH TWO OR MORE SINGLE CRYSTAL ACOUSTIC RESONATORDEVICES”, filed Jun. 2, 2014; U.S. patent application Ser. No.14/341,314, titled “WAFER SCALE PACKAGING”, filed Jul. 25, 2014; U.S.patent application Ser. No. 14/449,001, titled “MOBILE COMMUNICATIONDEVICE CONFIGURED WITH A SINGLE CRYSTAL PIEZO RESONATOR STRUCTURE”,filed Jul. 31, 2014; U.S. patent application Ser. No. 14/469,503, titled“MEMBRANE SUBSTRATE STRUCTURE FOR SINGLE CRYSTAL ACOUSTIC RESONATORDEVICE”, filed Aug. 26, 2014; and U.S. patent application Ser. No.15/068,510, titled “METHOD OF MANUFACTURE FOR SINGLE CRYSTAL ACOUSTICRESONATOR DEVICES USING MICRO-VIAS,” filed Mar. 11, 2016.

BACKGROUND OF THE INVENTION

The present invention relates generally to electronic devices. Moreparticularly, the present invention provides techniques related to amethod of manufacture and a structure for bulk acoustic wave resonatordevices, single crystal bulk acoustic wave resonator devices, singlecrystal filter and resonator devices, and the like. Merely by way ofexample, the invention has been applied to a single crystal resonatordevice for a communication device, mobile device, computing device,among others.

Mobile telecommunication devices have been successfully deployedworld-wide. Over a billion mobile devices, including cell phones andsmartphones, were manufactured in a single year and unit volumecontinues to increase year-over-year. With ramp of 4G/LTE in about 2012,and explosion of mobile data traffic, data rich content is driving thegrowth of the smartphone segment—which is expected to reach 2B per annumwithin the next few years. Coexistence of new and legacy standards andthirst for higher data rate requirements is driving RF complexity insmartphones. Unfortunately, limitations exist with conventional RFtechnology that is problematic, and may lead to drawbacks in the future.

With 4G LTE and 5G growing more popular by the day, wireless datacommunication demands high performance RF filters with frequenciesaround 5 GHz and higher. Bulk acoustic wave resonators (BAWR) usingcrystalline piezoelectric thin films are leading candidates for meetingsuch demands. Current BAWRs using polycrystalline piezoelectric thinfilms are adequate for bulk acoustic wave (BAW) filters operating atfrequencies ranging from 1 to 3 GHz; however, the quality of thepolycrystalline piezoelectric films degrades quickly as the thicknessesdecrease below around 0.5 um, which is required for resonators andfilters operating at frequencies around 5 GHz and above. Singlecrystalline or epitaxial piezoelectric thin films grown on compatiblecrystalline substrates exhibit good crystalline quality and highpiezoelectric performance even down to very thin thicknesses, e.g., 0.4um. Even so, there are challenges to using and transferring singlecrystal piezoelectric thin films in the manufacture of BAWR and BAWfilters.

From the above, it is seen that techniques for improving methods ofmanufacture and structures for acoustic resonator devices are highlydesirable.

BRIEF SUMMARY OF THE INVENTION

According to the present invention, techniques generally related toelectronic devices are provided. More particularly, the presentinvention provides techniques related to a method of manufacture andstructure for bulk acoustic wave resonator devices, single crystalresonator devices, single crystal filter and resonator devices, and thelike. Merely by way of example, the invention has been applied to asingle crystal resonator device for a communication device, mobiledevice, computing device, among others.

In an example, the present invention provides an RF filter circuitdevice in a ladder configuration. The device can include an input port,a first node coupled to the input port, a first resonator coupledbetween the first node and the input port. A second node is coupled tothe first node and a second resonator is coupled between the first nodeand the second node. A third node is coupled to the second node and athird resonator is coupled between the second node and the third node. Afourth node is coupled to the third node and a fourth resonator iscoupled between the third node and the output port. Further, an outputport is coupled to the fourth node. Those of ordinary skill in the artwill recognize other variations, modifications, and alternatives.

Each of the first, second, third, and fourth resonators can include acapacitor device. Each such capacitor device can include a substratemember, which has a cavity region and an upper surface region contiguouswith an opening in the first cavity region. Each capacitor device caninclude a bottom electrode within a portion of the cavity region and apiezoelectric material overlying the upper surface region and the bottomelectrode. Also, each capacitor device can include a top electrodeoverlying the single crystal material and the bottom electrode, as wellas an insulating material overlying the top electrode and configuredwith a thickness to tune the resonator. As used, the terms “top” and“bottom” are not terms in reference to a direction of gravity. Rather,these terms are used in reference to each other in context of thepresent device and related circuits. Those of ordinary skill in the artwould recognize other modifications, variations, and alternatives.

The device also includes a serial configuration includes the input port,the first node, the first resonator, the second node, the secondresonator, the third node, the third resonator, the fourth resonator,the fourth node, and the output port. A separate shunt configurationresonator is coupled to each of the first, second, third, fourth nodes.A parallel configuration includes the first, second, third, and fourthshunt configuration resonators. Further, a triplexer circuit responsecan be configured between the input port and the output port andconfigured from the serial configuration and the parallel configurationto achieve a transmission loss from three pass-bands collectively havinga characteristic frequency centered around 5.1275 GHz and having acollective bandwidth from 4.400 GHz to 5.855 GHz such that thecharacteristic frequency centered around 5.1275 GHz is tuned from alower frequency ranging from about 4.0 GHz to 5.5 GHz.

In a specific example, the first, second, third, and fourthpiezoelectric materials are each essentially a single crystal aluminumnitride bearing material or aluminum scandium nitride bearing material,a single crystal gallium nitride bearing material or gallium aluminumbearing material, or the like. In another specific embodiment, thesepiezoelectric materials each comprise a polycrystalline aluminum nitridebearing material or aluminum scandium bearing material, or apolycrystalline gallium nitride bearing material or gallium aluminumbearing material, or the like.

In a specific example, the serial configuration forms a resonanceprofile and an anti-resonance profile. The parallel configuration alsoforms a resonance profile and an anti-resonance profile. These profilesare such that the resonance profile from the serial configuration isoff-set with the anti-resonance profile of the parallel configuration toform the pass-band.

In a specific example, the three pass-bands include a first band rangingfrom about 4.400 GHz to 5.000 GHz, a second band ranging from about5.150 GHz to about 5.350 GHz, and a third band ranging from about 5.470GHz to 5.855 GHz. In another example, the three pass-bands include afirst band ranging from about 4400 MHz to 5000 MHz centered around 4700MHz, a second band ranging from about 5170 MHz to about 5330 MHzcentered around 5235 MHz, and a third band ranging from about 5470 MHzto 5835 MHz centered around 5665 MHz. The pass-band is characterized bya band edge on each side of the pass-band and having an amplitudedifference ranging from 10 dB to 60 dB. The pass-band has a pair of bandedges; each of which has a transition region from the pass-band to astop band such that the transition region is no greater than 250 MHz. Inanother example, pass-band can include a pair of band edges and each ofthese band edges can have a transition region from the pass-band to astop band such that the transition region ranges from 5 MHz to 250 MHz.

In a specific example, each of the first, second, third, and fourthinsulating materials comprises a silicon nitride bearing material or anoxide bearing material configured with a silicon nitride material anoxide bearing material.

In a specific example, the present device can further include severalfeatures. The device can further include one or more rejection bandsrejecting signals below 4.400 GHz and above 5.855 GHz. The device canfurther include an insertion loss of less than 2.0 dB and an amplitudevariation characterizing the pass-band of 0.8 dB. Also, the device caninclude an attenuation of up to 35 dB for a frequency range of 1800 MHzto 2400 MHz associated with each of the three pass-bands; an attenuationof up to 40 dB for a frequency range of 3300 MHz to 4200 MHz associatedwith each of the three-pass bands; an attenuation of up to 45 dB for afrequency range of 5170 MHz to 5835 MHz associated with the first andthird bands; and an attenuation of up to 45 dB for a frequency range of5490 MHz to 5835 MHz associated with the second band; an attenuation ofup to 30 dB for a frequency range of 6000 MHz to 8500 MHz associatedwith the first band, an attenuation of up to 30 dB for a frequency rangeof 6000 MHZ to 8800 MHz associated with the second band, and anattenuation of up to 30 dB for a frequency range of 6000 MHz to 9500 MHzassociated with the third band; and an attenuation of up to 35 dB for afrequency range of 8800 MHz to 10000 MHz associated with the first band,an attenuation of up to 35 dB for a frequency range of 10300 MHz to11000 MHz, and an attenuation of up to 35 dB for a frequency range of11000 to 12000 MHz associated with the third band. The device canfurther include a return loss characterizing the pass-band of up to 12dB and the device can be operable from −30 Degrees Celsius to 85 DegreesCelsius. The device can further include a maximum power within thepass-band of +30 dBm or 1 Watt, when driven by a signal whosecharacteristic contains a peak-to-average (PAR) signal of 9 dB. Further,the pass-band can be configured for 5.0 GHz Wi-Fi and 5G applications.

In a specific example, the present device can be configured as a bulkacoustic wave (BAW) filter device. Each of the first, second, third, andfourth resonators can be a BAW resonator. Similarly, each of the first,second, third, and fourth shunt resonators can be BAW resonators. Thepresent device can further include one or more additional resonatordevices numbered from N to M, where N is four and M is twenty.Similarly, the present device can further include one or more additionalshunt resonator devices numbered from N to M, where N is four and M istwenty.

In an example, the present invention provides an RF circuit device in alattice configuration. The device can include a differential input port,a top serial configuration, a bottom serial configuration, a firstlattice configuration, a second lattice configuration, and adifferential output port. The top serial configuration can include afirst top node, a second top node, and a third top node. A first topresonator can be coupled between the first top node and the second topnode, while a second top resonator can be coupled between the second topnode and the third top node. Similarly, the bottom serial configurationcan include a first bottom node, a second bottom node, and a thirdbottom node. A first bottom resonator can be coupled between the firstbottom node and the second bottom node, while a second bottom resonatorcan be coupled between the second bottom node and the third bottom node.

In an example, the first lattice configuration includes a first shuntresonator cross-coupled with a second shunt resonator and coupledbetween the first top resonator of the top serial configuration and thefirst bottom resonator of the bottom serial configuration. Similarly,the second lattice configuration can include a first shunt resonatorcross-coupled with a second shunt resonator and coupled between thesecond top resonator of the top serial configuration and the secondbottom resonator of the bottom serial configuration. The top serialconfiguration and the bottom serial configuration can each be coupled toboth the differential input port and the differential output port.

In a specific example, the device further includes a first balun coupledto the differential input port and a second balun coupled to thedifferential output port. The device can further include an inductordevice coupled between the differential input and output ports. In aspecific example, the device can further include a first inductor devicecoupled between the first top node of the top serial configuration andthe first bottom node of the bottom serial configuration; a secondinductor device coupled between the second top node of the top serialconfiguration and the second bottom node of the bottom serialconfiguration; and a third inductor device coupled between the third topnode of the top serial configuration and the third bottom node of thebottom serial configuration.

One or more benefits are achieved over pre-existing techniques using theinvention. In particular, the present device can be manufactured in arelatively simple and cost effective manner while using conventionalmaterials and/or methods according to one of ordinary skill in the art.The present device provides an ultra-small form factor RF resonatorfilter with high rejection, high power rating, and low insertion loss.Such filters or resonators can be implemented in an RF filter device, anRF filter system, or the like. Depending upon the embodiment, one ormore of these benefits may be achieved.

A further understanding of the nature and advantages of the inventionmay be realized by reference to the latter portions of the specificationand attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more fully understand the present invention, reference ismade to the accompanying drawings. Understanding that these drawings arenot to be considered limitations in the scope of the invention, thepresently described embodiments and the presently understood best modeof the invention are described with additional detail through use of theaccompanying drawings in which:

FIG. 1A is a simplified diagram illustrating an acoustic resonatordevice having topside interconnections according to an example of thepresent invention.

FIG. 1B is a simplified diagram illustrating an acoustic resonatordevice having bottom-side interconnections according to an example ofthe present invention.

FIG. 1C is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections accordingto an example of the present invention.

FIG. 1D is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections with ashared backside trench according to an example of the present invention.

FIGS. 2 and 3 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIG. 4A is a simplified diagram illustrating a step for a methodcreating a topside micro-trench according to an example of the presentinvention.

FIGS. 4B and 4C are simplified diagrams illustrating alternative methodsfor conducting the method step of forming a topside micro-trench asdescribed in FIG. 4A.

FIGS. 4D and 4E are simplified diagrams illustrating an alternativemethod for conducting the method step of forming a topside micro-trenchas described in FIG. 4A.

FIGS. 5 to 8 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIG. 9A is a simplified diagram illustrating a method step for formingbackside trenches according to an example of the present invention.

FIGS. 9B and 9C are simplified diagrams illustrating an alternativemethod for conducting the method step of forming backside trenches, asdescribed in FIG. 9A, and simultaneously singulating a seed substrateaccording to an embodiment of the present invention.

FIG. 10 is a simplified diagram illustrating a method step formingbackside metallization and electrical interconnections between top andbottom sides of a resonator according to an example of the presentinvention.

FIGS. 11A and 11B are simplified diagrams illustrating alternative stepsfor a method of manufacture for an acoustic resonator device accordingto an example of the present invention.

FIGS. 12A to 12E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device using a blind viainterposer according to an example of the present invention.

FIG. 13 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIGS. 14A to 14G are simplified diagrams illustrating method steps for acap wafer process for an acoustic resonator device according to anexample of the present invention.

FIGS. 15A-15E are simplified diagrams illustrating method steps formaking an acoustic resonator device with shared backside trench, whichcan be implemented in both interposer/cap and interposer free versions,according to examples of the present invention.

FIGS. 16A-16C through FIGS. 31A-31C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a transfer process using a sacrificiallayer for single crystal acoustic resonator devices according to anexample of the present invention.

FIGS. 32A-32C through FIGS. 46A-46C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a cavity bond transfer process for singlecrystal acoustic resonator devices according to an example of thepresent invention.

FIGS. 47A-47C though FIGS. 59A-59C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a solidly mounted transfer process forsingle crystal acoustic resonator devices according to an example of thepresent invention.

FIG. 60 is a simplified diagram illustrating filter pass-bandrequirements in a radio frequency spectrum according to an example ofthe present invention.

FIG. 61 is a simplified diagram illustrating an overview of key marketsthat are applications for acoustic wave RF filters according to anexample of the present invention.

FIG. 62 is a simplified diagram illustrating application areas for 5.5GHz RF filters in mobile applications according to examples of thepresent invention.

FIGS. 63A-63C are simplified diagrams illustrating cross-sectional viewsof resonator devices according to various examples of the presentinvention.

FIGS. 64A-64C are simplified circuit diagrams illustratingrepresentative lattrice and ladder configurations for acoustic filterdesigns according to examples of the present invention.

FIGS. 65A-65B are simplified diagrams illustrating packing approachesaccording to various examples of the present invention.

FIGS. 66A-66B are simplified diagrams illustrating packing approachesaccording to various examples of the present invention.

FIG. 67 is a simplified circuit diagram illustrating a 2-port BAW RFfilter circuit according to an example of the present invention.

FIG. 68 is a simplified table of filter parameters according to anexample of the present invention.

FIGS. 69A and 69B are simplified graphs representing insertion loss overfrequency according to examples of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

According to the present invention, techniques generally related toelectronic devices are provided. More particularly, the presentinvention provides techniques related to a method of manufacture andstructure for bulk acoustic wave resonator devices, single crystalresonator devices, single crystal filter and resonator devices, and thelike. Merely by way of example, the invention has been applied to asingle crystal resonator device for a communication device, mobiledevice, computing device, among others.

FIG. 1A is a simplified diagram illustrating an acoustic resonatordevice 101 having topside interconnections according to an example ofthe present invention. As shown, device 101 includes a thinned seedsubstrate 112 with an overlying single crystal piezoelectric layer 120,which has a micro-via 129. The micro-via 129 can include a topsidemicro-trench 121, a topside metal plug 146, a backside trench 114, and abackside metal plug 147. Although device 101 is depicted with a singlemicro-via 129, device 101 may have multiple micro-vias. A topside metalelectrode 130 is formed overlying the piezoelectric layer 120. A top capstructure is bonded to the piezoelectric layer 120. This top capstructure includes an interposer substrate 119 with one or morethrough-vias 151 that are connected to one or more top bond pads 143,one or more bond pads 144, and topside metal 145 with topside metal plug146. Solder balls 170 are electrically coupled to the one or more topbond pads 143.

The thinned substrate 112 has the first and second backside trenches113, 114. A backside metal electrode 131 is formed underlying a portionof the thinned seed substrate 112, the first backside trench 113, andthe topside metal electrode 130. The backside metal plug 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal 145. This backside metal plug147 is electrically coupled to the topside metal plug 146 and thebackside metal electrode 131. A backside cap structure 161 is bonded tothe thinned seed substrate 112, underlying the first and second backsidetrenches 113, 114. Further details relating to the method of manufactureof this device will be discussed starting from FIG. 2 .

FIG. 1B is a simplified diagram illustrating an acoustic resonatordevice 102 having backside interconnections according to an example ofthe present invention. As shown, device 101 includes a thinned seedsubstrate 112 with an overlying piezoelectric layer 120, which has amicro-via 129. The micro-via 129 can include a topside micro-trench 121,a topside metal plug 146, a backside trench 114, and a backside metalplug 147. Although device 102 is depicted with a single micro-via 129,device 102 may have multiple micro-vias. A topside metal electrode 130is formed overlying the piezoelectric layer 120. A top cap structure isbonded to the piezoelectric layer 120. This top cap structure 119includes bond pads which are connected to one or more bond pads 144 andtopside metal 145 on piezoelectric layer 120. The topside metal 145includes a topside metal plug 146.

The thinned substrate 112 has the first and second backside trenches113, 114. A backside metal electrode 131 is formed underlying a portionof the thinned seed substrate 112, the first backside trench 113, andthe topside metal electrode 130. A backside metal plug 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal plug 146. This backside metalplug 147 is electrically coupled to the topside metal plug 146. Abackside cap structure 162 is bonded to the thinned seed substrate 112,underlying the first and second backside trenches. One or more backsidebond pads (171, 172, 173) are formed within one or more portions of thebackside cap structure 162. Solder balls 170 are electrically coupled tothe one or more backside bond pads 171-173. Further details relating tothe method of manufacture of this device will be discussed starting fromFIG. 14A.

FIG. 1C is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections accordingto an example of the present invention. As shown, device 103 includes athinned seed substrate 112 with an overlying single crystalpiezoelectric layer 120, which has a micro-via 129. The micro-via 129can include a topside micro-trench 121, a topside metal plug 146, abackside trench 114, and a backside metal plug 147. Although device 103is depicted with a single micro-via 129, device 103 may have multiplemicro-vias. A topside metal electrode 130 is formed overlying thepiezoelectric layer 120. The thinned substrate 112 has the first andsecond backside trenches 113, 114. A backside metal electrode 131 isformed underlying a portion of the thinned seed substrate 112, the firstbackside trench 113, and the topside metal electrode 130. A backsidemetal plug 147 is formed underlying a portion of the thinned seedsubstrate 112, the second backside trench 114, and the topside metal145. This backside metal plug 147 is electrically coupled to the topsidemetal plug 146 and the backside metal electrode 131. Further detailsrelating to the method of manufacture of this device will be discussedstarting from FIG. 2 .

FIG. 1D is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections with ashared backside trench according to an example of the present invention.As shown, device 104 includes a thinned seed substrate 112 with anoverlying single crystal piezoelectric layer 120, which has a micro-via129. The micro-via 129 can include a topside micro-trench 121, a topsidemetal plug 146, and a backside metal 147. Although device 104 isdepicted with a single micro-via 129, device 104 may have multiplemicro-vias. A topside metal electrode 130 is formed overlying thepiezoelectric layer 120. The thinned substrate 112 has a first backsidetrench 113. A backside metal electrode 131 is formed underlying aportion of the thinned seed substrate 112, the first backside trench113, and the topside metal electrode 130. A backside metal 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal 145. This backside metal 147is electrically coupled to the topside metal plug 146 and the backsidemetal electrode 131. Further details relating to the method ofmanufacture of this device will be discussed starting from FIG. 2 .

FIGS. 2 and 3 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1A. FIG. 2 can represent a method step of providing a partiallyprocessed piezoelectric substrate. As shown, device 102 includes a seedsubstrate 110 with a piezoelectric layer 120 formed overlying. In aspecific example, the seed substrate can include silicon, siliconcarbide, aluminum oxide, or single crystal aluminum gallium nitridematerials, or the like. The piezoelectric layer 120 can include apiezoelectric single crystal layer or a thin film piezoelectric singlecrystal layer.

FIG. 3 can represent a method step of forming a top side metallizationor top resonator metal electrode 130. In a specific example, the topsidemetal electrode 130 can include a molybdenum, aluminum, ruthenium, ortitanium material, or the like and combinations thereof. This layer canbe deposited and patterned on top of the piezoelectric layer by alift-off process, a wet etching process, a dry etching process, a metalprinting process, a metal laminating process, or the like. The lift-offprocess can include a sequential process of lithographic patterning,metal deposition, and lift-off steps to produce the topside metal layer.The wet/dry etching processes can includes sequential processes of metaldeposition, lithographic patterning, metal deposition, and metal etchingsteps to produce the topside metal layer. Those of ordinary skill in theart will recognize other variations, modifications, and alternatives.

FIG. 4A is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 401 according to an exampleof the present invention. This figure can represent a method step offorming one or more topside micro-trenches 121 within a portion of thepiezoelectric layer 120. This topside micro-trench 121 can serve as themain interconnect junction between the top and bottom sides of theacoustic membrane, which will be developed in later method steps. In anexample, the topside micro-trench 121 is extends all the way through thepiezoelectric layer 120 and stops in the seed substrate 110. Thistopside micro-trench 121 can be formed through a dry etching process, alaser drilling process, or the like. FIGS. 4B and 4C describe theseoptions in more detail.

FIGS. 4B and 4C are simplified diagrams illustrating alternative methodsfor conducting the method step as described in FIG. 4A. As shown, FIG.4B represents a method step of using a laser drill, which can quicklyand accurately form the topside micro-trench 121 in the piezoelectriclayer 120. In an example, the laser drill can be used to form nominal 50um holes, or holes between 10 um and 500 um in diameter, through thepiezoelectric layer 120 and stop in the seed substrate 110 below theinterface between layers 120 and 110. A protective layer 122 can beformed overlying the piezoelectric layer 120 and the topside metalelectrode 130. This protective layer 122 can serve to protect the devicefrom laser debris and to provide a mask for the etching of the topsidemicro-via 121. In a specific example, the laser drill can be an 11 Whigh power diode-pumped UV laser, or the like. This mask 122 can besubsequently removed before proceeding to other steps. The mask may alsobe omitted from the laser drilling process, and air flow can be used toremove laser debris.

FIG. 4C can represent a method step of using a dry etching process toform the topside micro-trench 121 in the piezoelectric layer 120. Asshown, a lithographic masking layer 123 can be forming overlying thepiezoelectric layer 120 and the topside metal electrode 130. The topsidemicro-trench 121 can be formed by exposure to plasma, or the like.

FIGS. 4D and 4E are simplified diagrams illustrating an alternativemethod for conducting the method step as described in FIG. 4A. Thesefigures can represent the method step of manufacturing multiple acousticresonator devices simultaneously. In FIG. 4D, two devices are shown onDie #1 and Die #2, respectively. FIG. 4E shows the process of forming amicro-via 121 on each of these dies while also etching a scribe line 124or dicing line. In an example, the etching of the scribe line 124singulates and relieves stress in the piezoelectric single crystal layer120.

FIGS. 5 to 8 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. FIG. 5 can represent the method step of formingone or more bond pads 140 and forming a topside metal 141 electricallycoupled to at least one of the bond pads 140. The topside metal 141 caninclude a topside metal plug 146 formed within the topside micro-trench121. In a specific example, the topside metal plug 146 fills the topsidemicro-trench 121 to form a topside portion of a micro-via.

In an example, the bond pads 140 and the topside metal 141 can include agold material or other interconnect metal material depending upon theapplication of the device. These metal materials can be formed by alift-off process, a wet etching process, a dry etching process, ascreen-printing process, an electroplating process, a metal printingprocess, or the like. In a specific example, the deposited metalmaterials can also serve as bond pads for a cap structure, which will bedescribed below.

FIG. 6 can represent a method step for preparing the acoustic resonatordevice for bonding, which can be a hermetic bonding. As shown, a top capstructure is positioned above the partially processed acoustic resonatordevice as described in the previous figures. The top cap structure canbe formed using an interposer substrate 119 in two configurations: fullyprocessed interposer version 601 (through glass via) and partiallyprocessed interposer version 602 (blind via version). In the 601version, the interposer substrate 119 includes through-via structures151 that extend through the interposer substrate 119 and areelectrically coupled to bottom bond pads 142 and top bond pads 143. Inthe 602 version, the interposer substrate 119 includes blind viastructures 152 that only extend through a portion of the interposersubstrate 119 from the bottom side. These blind via structures 152 arealso electrically coupled to bottom bond pads 142. In a specificexample, the interposer substrate can include a silicon, glass,smart-glass, or other like material.

FIG. 7 can represent a method step of bonding the top cap structure tothe partially processed acoustic resonator device. As shown, theinterposer substrate 119 is bonded to the piezoelectric layer by thebond pads (140, 142) and the topside metal 141, which are now denoted asbond pad 144 and topside metal 145. This bonding process can be doneusing a compression bond method or the like. FIG. 8 can represent amethod step of thinning the seed substrate 110, which is now denoted asthinned seed substrate 111. This substrate thinning process can includegrinding and etching processes or the like. In a specific example, thisprocess can include a wafer backgrinding process followed by stressremoval, which can involve dry etching, CMP polishing, or annealingprocesses.

FIG. 9A is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 901 according to an exampleof the present invention. FIG. 9A can represent a method step forforming backside trenches 113 and 114 to allow access to thepiezoelectric layer from the backside of the thinned seed substrate 111.In an example, the first backside trench 113 can be formed within thethinned seed substrate 111 and underlying the topside metal electrode130. The second backside trench 114 can be formed within the thinnedseed substrate 111 and underlying the topside micro-trench 121 andtopside metal plug 146. This substrate is now denoted thinned substrate112. In a specific example, these trenches 113 and 114 can be formedusing deep reactive ion etching (DRIE) processes, Bosch processes, orthe like. The size, shape, and number of the trenches may vary with thedesign of the acoustic resonator device. In various examples, the firstbackside trench may be formed with a trench shape similar to a shape ofthe topside metal electrode or a shape of the backside metal electrode.The first backside trench may also be formed with a trench shape that isdifferent from both a shape of the topside metal electrode and thebackside metal electrode.

FIGS. 9B and 9C are simplified diagrams illustrating an alternativemethod for conducting the method step as described in FIG. 9A. LikeFIGS. 4D and 4E, these figures can represent the method step ofmanufacturing multiple acoustic resonator devices simultaneously. InFIG. 9B, two devices with cap structures are shown on Die #1 and Die #2,respectively. FIG. 9C shows the process of forming backside trenches(113, 114) on each of these dies while also etching a scribe line 115 ordicing line. In an example, the etching of the scribe line 115 providesan optional way to singulate the backside wafer 112.

FIG. 10 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 1000 according to anexample of the present invention. This figure can represent a methodstep of forming a backside metal electrode 131 and a backside metal plug147 within the backside trenches of the thinned seed substrate 112. Inan example, the backside metal electrode 131 can be formed underlyingone or more portions of the thinned substrate 112, within the firstbackside trench 113, and underlying the topside metal electrode 130.This process completes the resonator structure within the acousticresonator device. The backside metal plug 147 can be formed underlyingone or more portions of the thinned substrate 112, within the secondbackside trench 114, and underlying the topside micro-trench 121. Thebackside metal plug 147 can be electrically coupled to the topside metalplug 146 and the backside metal electrode 131. In a specific example,the backside metal electrode 130 can include a molybdenum, aluminum,ruthenium, or titanium material, or the like and combinations thereof.The backside metal plug can include a gold material, low resistivityinterconnect metals, electrode metals, or the like. These layers can bedeposited using the deposition methods described previously.

FIGS. 11A and 11B are simplified diagrams illustrating alternative stepsfor a method of manufacture for an acoustic resonator device accordingto an example of the present invention. These figures show methods ofbonding a backside cap structure underlying the thinned seed substrate112. In FIG. 11A, the backside cap structure is a dry film cap 161,which can include a permanent photo-imageable dry film such as a soldermask, polyimide, or the like. Bonding this cap structure can becost-effective and reliable, but may not produce a hermetic seal. InFIG. 11B, the backside cap structure is a substrate 162, which caninclude a silicon, glass, or other like material. Bonding this substratecan provide a hermetic seal, but may cost more and require additionalprocesses. Depending upon application, either of these backside capstructures can be bonded underlying the first and second backside vias.

FIGS. 12A to 12E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. More specifically, these figures describeadditional steps for processing the blind via interposer “602” versionof the top cap structure. FIG. 12A shows an acoustic resonator device1201 with blind vias 152 in the top cap structure. In FIG. 12B, theinterposer substrate 119 is thinned, which forms a thinned interposersubstrate 118, to expose the blind vias 152. This thinning process canbe a combination of a grinding process and etching process as describedfor the thinning of the seed substrate. In FIG. 12C, a redistributionlayer (RDL) process and metallization process can be applied to createtop cap bond pads 160 that are formed overlying the blind vias 152 andare electrically coupled to the blind vias 152. As shown in FIG. 12D, aball grid array (BGA) process can be applied to form solder balls 170overlying and electrically coupled to the top cap bond pads 160. Thisprocess leaves the acoustic resonator device ready for wire bonding 171,as shown in FIG. 12E.

FIG. 13 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. As shown, device 1300 includes two fullyprocessed acoustic resonator devices that are ready to singulation tocreate separate devices. In an example, the die singulation process canbe done using a wafer dicing saw process, a laser cut singulationprocess, or other processes and combinations thereof.

FIGS. 14A to 14G are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1B. The method for this example of an acoustic resonator can go throughsimilar steps as described in FIGS. 1-5 . FIG. 14A shows where thismethod differs from that described previously. Here, the top capstructure substrate 119 and only includes one layer of metallizationwith one or more bottom bond pads 142. Compared to FIG. 6 , there are novia structures in the top cap structure because the interconnectionswill be formed on the bottom side of the acoustic resonator device.

FIGS. 14B to 14F depict method steps similar to those described in thefirst process flow. FIG. 14B can represent a method step of bonding thetop cap structure to the piezoelectric layer 120 through the bond pads(140, 142) and the topside metal 141, now denoted as bond pads 144 andtopside metal 145 with topside metal plug 146. FIG. 14C can represent amethod step of thinning the seed substrate 110, which forms a thinnedseed substrate 111, similar to that described in FIG. 8 . FIG. 14D canrepresent a method step of forming first and second backside trenches,similar to that described in FIG. 9A. FIG. 14E can represent a methodstep of forming a backside metal electrode 131 and a backside metal plug147, similar to that described in FIG. 10 . FIG. 14F can represent amethod step of bonding a backside cap structure 162, similar to thatdescribed in FIGS. 11A and 11B.

FIG. 14G shows another step that differs from the previously describedprocess flow. Here, the backside bond pads 171, 172, and 173 are formedwithin the backside cap structure 162. In an example, these backsidebond pads 171-173 can be formed through a masking, etching, and metaldeposition processes similar to those used to form the other metalmaterials. A BGA process can be applied to form solder balls 170 incontact with these backside bond pads 171-173, which prepares theacoustic resonator device 1407 for wire bonding.

FIGS. 15A to 15E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1B. The method for this example can go through similar steps asdescribed in FIG. 1-5 . FIG. 15A shows where this method differs fromthat described previously. A temporary carrier 218 with a layer oftemporary adhesive 217 is attached to the substrate. In a specificexample, the temporary carrier 218 can include a glass wafer, a siliconwafer, or other wafer and the like.

FIGS. 15B to 15F depict method steps similar to those described in thefirst process flow. FIG. 15B can represent a method step of thinning theseed substrate 110, which forms a thinned substrate 111, similar to thatdescribed in FIG. 8 . In a specific example, the thinning of the seedsubstrate 110 can include a back side grinding process followed by astress removal process. The stress removal process can include a dryetch, a Chemical Mechanical Planarization (CMP), and annealingprocesses.

FIG. 15C can represent a method step of forming a shared backside trench113, similar to the techniques described in FIG. 9A. The main differenceis that the shared backside trench is configured underlying both topsidemetal electrode 130, topside micro-trench 121, and topside metal plug146. In an example, the shared backside trench 113 is a backsideresonator cavity that can vary in size, shape (all possible geometricshapes), and side wall profile (tapered convex, tapered concave, orright angle). In a specific example, the forming of the shared backsidetrench 113 can include a litho-etch process, which can include aback-to-front alignment and dry etch of the backside substrate 111. Thepiezoelectric layer 120 can serve as an etch stop layer for the formingof the shared backside trench 113.

FIG. 15D can represent a method step of forming a backside metalelectrode 131 and a backside metal 147, similar to that described inFIG. 10 . In an example, the forming of the backside metal electrode 131can include a deposition and patterning of metal materials within theshared backside trench 113. Here, the backside metal 131 serves as anelectrode and the backside plug/connect metal 147 within the micro-via121. The thickness, shape, and type of metal can vary as a function ofthe resonator/filter design. As an example, the backside electrode 131and via plug metal 147 can be different metals. In a specific example,these backside metals 131, 147 can either be deposited and patterned onthe surface of the piezoelectric layer 120 or rerouted to the backsideof the substrate 112. In an example, the backside metal electrode may bepatterned such that it is configured within the boundaries of the sharedbackside trench such that the backside metal electrode does not come incontact with one or more side-walls of the seed substrate created duringthe forming of the shared backside trench.

FIG. 15E can represent a method step of bonding a backside cap structure162, similar to that described in FIGS. 11A and 11B, following ade-bonding of the temporary carrier 218 and cleaning of the topside ofthe device to remove the temporary adhesive 217. Those of ordinary skillin the art will recognize other variations, modifications, andalternatives of the methods steps described previously.

As used herein, the term “substrate” can mean the bulk substrate or caninclude overlying growth structures such as an aluminum, gallium, orternary compound of aluminum and gallium and nitrogen containingepitaxial region, or functional regions, combinations, and the like.

One or more benefits are achieved over pre-existing techniques using theinvention. In particular, the present device can be manufactured in arelatively simple and cost effective manner while using conventionalmaterials and/or methods according to one of ordinary skill in the art.Using the present method, one can create a reliable single crystal basedacoustic resonator using multiple ways of three-dimensional stackingthrough a wafer level process. Such filters or resonators can beimplemented in an RF filter device, an RF filter system, or the like.Depending upon the embodiment, one or more of these benefits may beachieved. Of course, there can be other variations, modifications, andalternatives.

With 4G LTE and 5G growing more popular by the day, wireless datacommunication demands high performance RF filters with frequenciesaround 5 GHz and higher. Bulk acoustic wave resonators (BAWR), widelyused in such filters operating at frequencies around3 GHz and lower, areleading candidates for meeting such demands. Current bulk acoustic waveresonators use polycrystalline piezoelectric AIN thin films where eachgrain's c-axis is aligned perpendicular to the film's surface to allowhigh piezoelectric performance whereas the grains' a- or b-axis arerandomly distributed. This peculiar grain distribution works well whenthe piezoelectric film's thickness is around 1 um and above, which isthe perfect thickness for bulk acoustic wave (BAW) filters operating atfrequencies ranging from 1 to 3 GHz. However, the quality of thepolycrystalline piezoelectric films degrades quickly as the thicknessesdecrease below around 0.5 um, which is required for resonators andfilters operating at frequencies around 5 GHz and above.

Single crystalline or epitaxial piezoelectric thin films grown oncompatible crystalline substrates exhibit good crystalline quality andhigh piezoelectric performance even down to very thin thicknesses, e.g.,0.4 um. The present invention provides manufacturing processes andstructures for high quality bulk acoustic wave resonators with singlecrystalline or epitaxial piezoelectric thn films for high frequency BAWfilter applications.

BAWRs require a piezoelectric material, e.g., AlN, in crystalline form,i.e., polycrystalline or single crystalline. The quality of the filmheavy depends on the chemical, crystalline, or topographical quality ofthe layer on which the film is grown. In conventional BAWR processes(including film bulk acoustic resonator (FBAR) or solidly mountedresonator (SMR) geometry), the piezoelectric film is grown on apatterned bottom electrode, which is usually made of molybdenum (Mo),tungsten (W), or ruthenium (Ru). The surface geometry of the patternedbottom electrode significantly influences the crystalline orientationand crystalline quality of the piezoelectric film, requiring complicatedmodification of the structure.

Thus, the present invention uses single crystalline piezoelectric filmsand thin film transfer processes to produce a BAWR with enhancedultimate quality factor and electro-mechanical coupling for RF filters.Such methods and structures facilitate methods of manufacturing andstructures for RF filters using single crystalline or epitaxialpiezoelectric films to meet the growing demands of contemporary datacommunication.

In an example, the present invention provides transfer structures andprocesses for acoustic resonator devices, which provides a flat,high-quality, single-crystal piezoelectric film for superior acousticwave control and high Q in high frequency. As described above,polycrystalline piezoelectric layers limit Q in high frequency. Also,growing epitaxial piezoelectric layers on patterned electrodes affectsthe crystalline orientation of the piezoelectric layer, which limits theability to have tight boundary control of the resulting resonators.Embodiments of the present invention, as further described below, canovercome these limitations and exhibit improved performance andcost-efficiency.

FIGS. 16A-16C through FIGS. 31A-31C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure with asacrificial layer. In these figure series described below, the “A”figures show simplified diagrams illustrating top cross-sectional viewsof single crystal resonator devices according to various embodiments ofthe present invention. The “B” figures show simplified diagramsillustrating lengthwise cross-sectional views of the same devices in the“A” figures. Similarly, the “C” figures show simplified diagramsillustrating widthwise cross-sectional views of the same devices in the“A” figures. In some cases, certain features are omitted to highlightother features and the relationships between such features. Those ofordinary skill in the art will recognize variations, modifications, andalternatives to the examples shown in these figure series.

FIGS. 16A-16C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a piezoelectric film 1620 overlying a growth substrate 1610. Inan example, the growth substrate 1610 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 1620 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 17A-17C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first electrode 1710 overlying the surface region of thepiezoelectric film 1620. In an example, the first electrode 1710 caninclude molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials. In a specific example, the first electrode 1710 can besubjected to a dry etch with a slope. As an example, the slope can beabout 60 degrees.

FIGS. 18A-18C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first passivation layer 1810 overlying the first electrode1710 and the piezoelectric film 1620. In an example, the firstpassivation layer 1810 can include silicon nitride (SiN), silicon oxide(SiOx), or other like materials. In a specific example, the firstpassivation layer 1810 can have a thickness ranging from about 50 nm toabout 100 nm.

FIGS. 19A-19C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a sacrificial layer 1910 overlying a portion of the firstelectrode 1810 and a portion of the piezoelectric film 1620. In anexample, the sacrificial layer 1910 can include polycrystalline silicon(poly-Si), amorphous silicon (a-Si), or other like materials. In aspecific example, this sacrificial layer 1910 can be subjected to a dryetch with a slope and be deposited with a thickness of about 1 um.Further, phosphorous doped SiO₂ (PSG) can be used as the sacrificiallayer with different combinations of support layer (e.g., SiNx).

FIGS. 20A-20C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a support layer 2010 overlying the sacrificial layer 1910, thefirst electrode 1710, and the piezoelectric film 1620. As shown in FIG.20B, portions of a surface of support member 2010 define a cavity region90 within which at least a portion of first electrode 1710 is located.In an example, the support layer 2010 can include silicon dioxide(SiO2), silicon nitride (SiN), or other like materials. In a specificexample, this support layer 2010 can be deposited with a thickness ofabout 2-3 um. As described above, other support layers (e.g., SiNx) canbe used in the case of a PSG sacrificial layer.

FIGS. 21A-21C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofpolishing the support layer 2010 to form a polished support layer 2011.In an example, the polishing process can include a chemical-mechanicalplanarization process or the like. As shown in FIG. 21B, afterpolishing, cavity region 90 remains defined by portions of the surfaceof support member 2011.

FIGS. 22A-22C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate flipping thedevice and physically coupling overlying the support layer 2011overlying a bond substrate 2210. In an example, the bond substrate 2210can include a bonding support layer 2220 (SiO₂ or like material)overlying a substrate having silicon (Si), sapphire (Al₂O₃), silicondioxide (SiO₂), silicon carbide (SiC), or other like materials. In aspecific embodiment, the bonding support layer 2220 of the bondsubstrate 2210 is physically coupled to the polished support layer 2011.Further, the physical coupling process can include a room temperaturebonding process following by a 300 degree Celsius annealing process.

FIGS. 23A-23C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the growth substrate 1610 or otherwise the transfer of thepiezoelectric film 1620. In an example, the removal process can includea grinding process, a blanket etching process, a film transfer process,an ion implantation transfer process, a laser crack transfer process, orthe like and combinations thereof.

FIGS. 24A-24C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming an electrode contact via 2410 within the piezoelectric film 1620(becoming piezoelectric film 1621) overlying the first electrode 1710and forming one or more release holes 2420 within the piezoelectric film1620 and the first passivation layer 1810 overlying the sacrificiallayer 1910. The via forming processes can include various types ofetching processes.

FIGS. 25A-25C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second electrode 2510 overlying the piezoelectric film 1621.In an example, the formation of the second electrode 2510 includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching the second electrode 2510 to form anelectrode cavity 2511 and to remove portion 2511 from the secondelectrode to form a top metal 2520. Further, the top metal 2520 isphysically coupled to the first electrode 1720 through electrode contactvia 2410.

FIGS. 26A-26C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first contact metal 2610 overlying a portion of the secondelectrode 2510 and a portion of the piezoelectric film 1621, and forminga second contact metal 2611 overlying a portion of the top metal 2520and a portion of the piezoelectric film 1621. In an example, the firstand second contact metals can include gold (Au), aluminum (Al), copper(Cu), nickel (Ni), aluminum bronze (AlCu), or related alloys of thesematerials or other like materials.

FIGS. 27A-27C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second passivation layer 2710 overlying the second electrode2510, the top metal 2520, and the piezoelectric film 1621. In anexample, the second passivation layer 2710 can include silicon nitride(SiN), silicon oxide (SiOx), or other like materials. In a specificexample, the second passivation layer 2710 can have a thickness rangingfrom about 50 nm to about 100 nm.

FIGS. 28A-28C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the sacrificial layer 1910 to form an air cavity 2810. In anexample, the removal process can include a poly-Si etch or an a-Si etch,or the like. Portions of the support member 2011 surface define cavityregion 90 within which at least a portion of first electrode 1710 islocated. As shown in FIG. 28B, first electrode 1710 is located in cavityregion 90 such that the surface of the support member 2011 definingcavity region 90 is contiguous with an upper surface of the electrode1710. First passivation layer 1810 when present can be considered as aportion of support member 5011.

FIGS. 29A-29C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the second electrode 2510 and the top metal 2520 toform a processed second electrode 2910 and a processed top metal 2920.This step can follow the formation of second electrode 2510 and topmetal 2520. In an example, the processing of these two componentsincludes depositing molybdenum (Mo), ruthenium (Ru), tungsten (W), orother like materials; and then etching (e.g., dry etch or the like) thismaterial to form the processed second electrode 2910 with an electrodecavity 2912 and the processed top metal 2920. The processed top metal2920 remains separated from the processed second electrode 2910 by theremoval of portion 2911. In a specific example, the processed secondelectrode 2910 is characterized by the addition of an energy confinementstructure configured on the processed second electrode 2910 to increaseQ. As shown in FIG. 29B, portions of the support member 2011 surfacedefine cavity region 90 within which at least a portion of firstelectrode 1710 is located.

FIGS. 30A-30C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 1710 to form a processed firstelectrode 2310. This step can follow the formation of first electrode1710. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 3010 with an electrode cavity,similar to the processed second electrode 2910. Air cavity 2811 showsthe change in cavity shape due to the processed first electrode 3010. Ina specific example, the processed first electrode 3010 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 3010 to increase Q. As shown in FIG. 30B,portions of the support member 2012 surface define cavity region 90within which at least a portion of first electrode 3010 is located.

FIGS. 31A-31C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 1710, to form a processed firstelectrode 3010, and the second electrode 2510/top metal 2520 to form aprocessed second electrode 2910/processed top metal 2920. FIG. 31B showsportions of the support member 2012 surface defining cavity region 90within which at least a portion of first electrode 3010 is located.These steps can follow the formation of each respective electrode, asdescribed for FIGS. 29A-29C and 30A-30C. Those of ordinary skill in theart will recognize other variations, modifications, and alternatives.

FIGS. 32A-32C through FIGS. 46A-46C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure withoutsacrificial layer. In these figure series described below, the “A”figures show simplified diagrams illustrating top cross-sectional viewsof single crystal resonator devices according to various embodiments ofthe present invention. The “B” figures show simplified diagramsillustrating lengthwise cross-sectional views of the same devices in the“A” figures. Similarly, the “C” figures show simplified diagramsillustrating widthwise cross-sectional views of the same devices in the“A” figures. In some cases, certain features are omitted to highlightother features and the relationships between such features. Those ofordinary skill in the art will recognize variations, modifications, andalternatives to the examples shown in these figure series.

FIGS. 32A-32C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming apiezoelectric film 3220 overlying a growth substrate 3210. In anexample, the growth substrate 3210 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 3220 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 33A-33C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstelectrode 3310 overlying the surface region of the piezoelectric film3220. In an example, the first electrode 3310 can include molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials. In aspecific example, the first electrode 3310 can be subjected to a dryetch with a slope. As an example, the slope can be about 60 degrees.

FIGS. 34A-34C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstpassivation layer 3410 overlying the first electrode 3310 and thepiezoelectric film 3220. In an example, the first passivation layer 3410can include silicon nitride (SiN), silicon oxide (SiOx), or other likematerials. In a specific example, the first passivation layer 3410 canhave a thickness ranging from about 50 nm to about 100 nm.

FIGS. 35A-35C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a supportlayer 3510 overlying the first electrode 3310, and the piezoelectricfilm 3220. In an example, the support layer 3510 can include silicondioxide (SiO₂), silicon nitride (SiN), or other like materials. In aspecific example, this support layer 3510 can be deposited with athickness of about 2-3 um. As described above, other support layers(e.g., SiNx) can be used in the case of a PSG sacrificial layer.

FIGS. 36A-36C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the optional method step of processingthe support layer 3510 (to form support layer 3511) in region 3610. Inan example, the processing can include a partial etch of the supportlayer 3510 to create a flat bond surface. In a specific example, theprocessing can include a cavity region. In other examples, this step canbe replaced with a polishing process such as a chemical-mechanicalplanarization process or the like.

FIGS. 37A-37C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming an air cavity3710 within a portion of the support layer 3511 (to form support layer3512). In an example, the cavity formation can include an etchingprocess that stops at the first passivation layer 3410.

FIGS. 38A-38C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming one or morecavity vent holes 3810 within a portion of the piezoelectric film 3220through the first passivation layer 3410. In an example, the cavity ventholes 3810 connect to the air cavity 3710.

FIGS. 39A-39C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate flipping the device and physicallycoupling overlying the support layer 3512 overlying a bond substrate3910. In an example, the bond substrate 3910 can include a bondingsupport layer 3920 (SiO₂ or like material) overlying a substrate havingsilicon (Si), sapphire (Al₂O₃), silicon dioxide (SiO₂), silicon carbide(SiC), or other like materials. In a specific embodiment, the bondingsupport layer 3920 of the bond substrate 3910 is physically coupled tothe polished support layer 3512. Further, the physical coupling processcan include a room temperature bonding process following by a 300 degreeCelsius annealing process.

FIGS. 40A-40C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of removing the growthsubstrate 3210 or otherwise the transfer of the piezoelectric film 3220.In an example, the removal process can include a grinding process, ablanket etching process, a film transfer process, an ion implantationtransfer process, a laser crack transfer process, or the like andcombinations thereof.

FIGS. 41A-41C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming an electrodecontact via 4110 within the piezoelectric film 3220 overlying the firstelectrode 3310. The via forming processes can include various types ofetching processes.

FIGS. 42A-42C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a secondelectrode 4210 overlying the piezoelectric film 3220. In an example, theformation of the second electrode 4210 includes depositing molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials; and thenetching the second electrode 4210 to form an electrode cavity 4211 andto remove portion 4211 from the second electrode to form a top metal4220. Further, the top metal 4220 is physically coupled to the firstelectrode 3310 through electrode contact via 4110.

FIGS. 43A-43C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstcontact metal 4310 overlying a portion of the second electrode 4210 anda portion of the piezoelectric film 3220, and forming a second contactmetal 4311 overlying a portion of the top metal 4220 and a portion ofthe piezoelectric film 3220. In an example, the first and second contactmetals can include gold (Au), aluminum (Al), copper (Cu), nickel (Ni),aluminum bronze (AlCu), or other like materials. This figure also showsthe method step of forming a second passivation layer 4320 overlying thesecond electrode 4210, the top metal 4220, and the piezoelectric film3220. In an example, the second passivation layer 4320 can includesilicon nitride (SiN), silicon oxide (SiOx), or other like materials. Ina specific example, the second passivation layer 4320 can have athickness ranging from about 50 nm to about 100 nm.

FIGS. 44A-44C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to another example of the present invention.As shown, these figures illustrate the method step of processing thesecond electrode 4210 and the top metal 4220 to form a processed secondelectrode 4410 and a processed top metal 4420. This step can follow theformation of second electrode 4210 and top metal 4220. In an example,the processing of these two components includes depositing molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials; and thenetching (e.g., dry etch or the like) this material to form the processedsecond electrode 4410 with an electrode cavity 4412 and the processedtop metal 4420. The processed top metal 4420 remains separated from theprocessed second electrode 4410 by the removal of portion 4411. In aspecific example, the processed second electrode 4410 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 4410 to increase Q.

FIGS. 45A-45C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 3310 to form a processed firstelectrode 4510. This step can follow the formation of first electrode3310. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 4510 with an electrode cavity,similar to the processed second electrode 4410. Air cavity 3711 showsthe change in cavity shape due to the processed first electrode 4510. Ina specific example, the processed first electrode 4510 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 4510 to increase Q.

FIGS. 46A-46C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 3310, to form a processed firstelectrode 4510, and the second electrode 4210/top metal 4220 to form aprocessed second electrode 4410/processed top metal 4420. These stepscan follow the formation of each respective electrode, as described forFIGS. 44A-44C and 45A-45C. Those of ordinary skill in the art willrecognize other variations, modifications, and alternatives.

FIGS. 47A-47C through FIGS. 59A-59C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure with amultilayer mirror structure. In these figure series described below, the“A” figures show simplified diagrams illustrating top cross-sectionalviews of single crystal resonator devices according to variousembodiments of the present invention. The “B” figures show simplifieddiagrams illustrating lengthwise cross-sectional views of the samedevices in the “A” figures. Similarly, the “C” figures show simplifieddiagrams illustrating widthwise cross-sectional views of the samedevices in the “A” figures. In some cases, certain features are omittedto highlight other features and the relationships between such features.Those of ordinary skill in the art will recognize variations,modifications, and alternatives to the examples shown in these figureseries.

FIGS. 47A-47C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a piezoelectric film 4720 overlying a growth substrate 4710. Inan example, the growth substrate 4710 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 4720 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 48A-48C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first electrode 4810 overlying the surface region of thepiezoelectric film 4720. In an example, the first electrode 4810 caninclude molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials. In a specific example, the first electrode 4810 can besubjected to a dry etch with a slope. As an example, the slope can beabout 60 degrees.

FIGS. 49A-49C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a multilayer mirror or reflector structure. In an example, themultilayer mirror includes at least one pair of layers with a lowimpedance layer 4910 and a high impedance layer 4920. In FIGS. 49A-49C,two pairs of low/high impedance layers are shown (low: 4910 and 4911;high: 4920 and 4921). In an example, the mirror/reflector area can belarger than the resonator area and can encompass the resonator area. Ina specific embodiment, each layer thickness is about ¼ of the wavelengthof an acoustic wave at a targeting frequency. The layers can bedeposited in sequence and be etched afterwards, or each layer can bedeposited and etched individually. In another example, the firstelectrode 4810 can be patterned after the mirror structure is patterned.

FIGS. 50A-50C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. Referring to FIG. 50B, portions of a surface ofsupport member 5010 define a cavity region 90 within which at least aportion of first electrode 4810 is located. As shown, these figuresillustrate the method step of forming a support layer 5010 overlying themirror structure (layers 4910, 4911, 4920, and 4921), the firstelectrode 4810, and the piezoelectric film 4720. In an example, thesupport layer 5010 can include silicon dioxide (SiO2), silicon nitride(SiN), or other like materials. In a specific example, this supportlayer 5010 can be deposited with a thickness of about 2-3 um. Asdescribed above, other support layers (e.g., SiNx) can be used.

FIGS. 51A-51C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofpolishing the support layer 5010 to form a polished support layer 5011.In an example, the polishing process can include a chemical-mechanicalplanarization process or the like. As shown in FIG. 51B, afterpolishing, cavity region 90 remains defined by portions of the surfaceof support member 5011.

FIGS. 52A-52C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate flipping thedevice and physically coupling overlying the support layer 5011overlying a bond substrate 5210. In an example, the bond substrate 5210can include a bonding support layer 5220 (SiO₂ or like material)overlying a substrate having silicon (Si), sapphire (Al₂O₃), silicondioxide (SiO₂), silicon carbide (SiC), or other like materials. In aspecific embodiment, the bonding support layer 5220 of the bondsubstrate 5210 is physically coupled to the polished support layer 5011.Further, the physical coupling process can include a room temperaturebonding process following by a 300 degree Celsius annealing process.

FIGS. 53A-53C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the growth substrate 4710 or otherwise the transfer of thepiezoelectric film 4720. In an example, the removal process can includea grinding process, a blanket etching process, a film transfer process,an ion implantation transfer process, a laser crack transfer process, orthe like and combinations thereof.

FIGS. 54A-54C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming an electrode contact via 5410 within the piezoelectric film 4720overlying the first electrode 4810. The via forming processes caninclude various types of etching processes.

FIGS. 55A-55C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second electrode 5510 overlying the piezoelectric film 4720.In an example, the formation of the second electrode 5510 includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching the second electrode 5510 to form anelectrode cavity 5511 and to remove portion 5511 from the secondelectrode to form a top metal 5520. Further, the top metal 5520 isphysically coupled to the first electrode 5520 through electrode contactvia 5410.

FIGS. 56A-56C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first contact metal 5610 overlying a portion of the secondelectrode 5510 and a portion of the piezoelectric film 4720, and forminga second contact metal 5611 overlying a portion of the top metal 5520and a portion of the piezoelectric film 4720. In an example, the firstand second contact metals can include gold (Au), aluminum (Al), copper(Cu), nickel (Ni), aluminum bronze (AlCu), or other like materials. Thisfigure also shows the method step of forming a second passivation layer5620 overlying the second electrode 5510, the top metal 5520, and thepiezoelectric film 4720. In an example, the second passivation layer5620 can include silicon nitride (SiN), silicon oxide (SiOx), or otherlike materials. In a specific example, the second passivation layer 5620can have a thickness ranging from about 50 nm to about 100 nm. Portionsof the support member 5011 surface define cavity region 90 within whichat least a portion of first electrode 4810 is located. As shown in FIG.56B, first electrode 4810 is located in cavity region 90 such that thesurface of the support member 5011 defining cavity region 90 iscontiguous with an upper surface of the electrode 4810. A passivationlayer when present can be considered as a portion of support member5011.

FIGS. 57A-57C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the second electrode 5510 and the top metal 5520 toform a processed second electrode 5710 and a processed top metal 5720.This step can follow the formation of second electrode 5710 and topmetal 5720. In an example, the processing of these two componentsincludes depositing molybdenum (Mo), ruthenium (Ru), tungsten (W), orother like materials; and then etching (e.g., dry etch or the like) thismaterial to form the processed second electrode 5410 with an electrodecavity 5712 and the processed top metal 5720. The processed top metal5720 remains separated from the processed second electrode 5710 by theremoval of portion 5711. In a specific example, this processing givesthe second electrode and the top metal greater thickness while creatingthe electrode cavity 5712. In a specific example, the processed secondelectrode 5710 is characterized by the addition of an energy confinementstructure configured on the processed second electrode 5710 to increaseQ. As shown in FIG. 57B, portions of the support member 5011 surfacedefine cavity region 90 within which at least a portion of firstelectrode 4810 is located.

FIGS. 58A-58C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 4810 to form a processed firstelectrode 5810. This step can follow the formation of first electrode4810. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 5810 with an electrode cavity,similar to the processed second electrode 5710. Compared to the twoprevious examples, there is no air cavity. In a specific example, theprocessed first electrode 5810 is characterized by the addition of anenergy confinement structure configured on the processed secondelectrode 5810 to increase Q. As shown in FIG. 58B, portions of thesupport member 5011 surface define cavity region 90 within which atleast a portion of first electrode 5810 is located.

FIGS. 59A-59C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 4810, to form a processed firstelectrode 5810, and the second electrode 5510/top metal 5520 to form aprocessed second electrode 5710/processed top metal 5720. FIG. 59B showsportions of the support member 5011 surface defining cavity region 90within which at least a portion of first electrode 5810 is located.These steps can follow the formation of each respective electrode, asdescribed for FIGS. 57A-57C and 58A-58C. Those of ordinary skill in theart will recognize other variations, modifications, and alternatives.

In each of the preceding examples relating to transfer processes, energyconfinement structures can be formed on the first electrode, secondelectrode, or both. In an example, these energy confinement structuresare mass loaded areas surrounding the resonator area. The resonator areais the area where the first electrode, the piezoelectric layer, and thesecond electrode overlap. The larger mass load in the energy confinementstructures lowers a cut-off frequency of the resonator. The cut-offfrequency is the lower or upper limit of the frequency at which theacoustic wave can propagate in a direction parallel to the surface ofthe piezoelectric film. Therefore, the cut-off frequency is theresonance frequency in which the wave is travelling along the thicknessdirection and thus is determined by the total stack structure of theresonator along the vertical direction. In piezoelectric films (e.g.,AIN), acoustic waves with lower frequency than the cut-off frequency canpropagate in a parallel direction along the surface of the film, i.e.,the acoustic wave exhibits a high-band-cut-off type dispersioncharacteristic. In this case, the mass loaded area surrounding theresonator provides a barrier preventing the acoustic wave frompropagating outside the resonator. By doing so, this feature increasesthe quality factor of the resonator and improves the performance of theresonator and, consequently, the filter.

In addition, the top single crystalline piezoelectric layer can bereplaced by a polycrystalline piezoelectric film. In such films, thelower part that is close to the interface with the substrate has poorcrystalline quality with smaller grain sizes and a wider distribution ofthe piezoelectric polarization orientation than the upper part of thefilm close to the surface. This is due to the polycrystalline growth ofthe piezoelectric film, i.e., the nucleation and initial film haverandom crystalline orientations. Considering AlN as a piezoelectricmaterial, the growth rate along the c-axis or the polarizationorientation is higher than other crystalline orientations that increasethe proportion of the grains with the c-axis perpendicular to the growthsurface as the film grows thicker. In a typical polycrystalline AlN filmwith about a 1 um thickness, the upper part of the film close to thesurface has better crystalline quality and better alignment in terms ofpiezoelectric polarization. By using the thin film transfer processcontemplated in the present invention, it is possible to use the upperportion of the polycrystalline film in high frequency BAW resonatorswith very thin piezoelectric films. This can be done by removing aportion of the piezoelectric layer during the growth substrate removalprocess. Of course, there can be other variations, modifications, andalternatives.

In an example, the present invention provides a high-performance,ultra-small pass-band Bulk Acoustic Wave (BAW) Radio Frequency (RF)Triplexer for use in 5 GHz and 5G applications. This circuit device has3 passbands covering n79, U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3bands, and a stopband rejecting signals below 5.15 GHz and above 5.85GHz. The n79, U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3 bands are shownin FIG. 60 .

FIG. 60 is a simplified diagram illustrating filter pass-bandrequirements in a radio frequency spectrum according to an example ofthe present invention. As shown, the frequency spectrum 6000 shows arange from about 3.0 GHz to about 7.0 GHz. Here, a first applicationband (3.3 GHz-4.2 GHz) 6010 is configured for 5G n77 applications. Thisband includes a 5G n78 sub-band (3.3 GHz-3.8 GHz) 6011, which includesfurther LTE sub-bands B42 (3.4 GHz-3.6 GHz) 6012, B43 (3.6 GHz-3.8 GHz)6013, and CRBS B48/49 (3.55 GHz-3.7 GHz) 6014. A second application band6020 (4.4 GHz-5.0 GHz) is configured for 5G n79 applications. Those ofordinary skill in the art will recognize other variations,modifications, and alternatives.

A third application band 6030 can be configured for the 5 GHz Wi-Fi and5G applications. In an example, this band can include a B252 sub-band(5.15 GHz-5.25 GHz) 6031, a B255 sub-band (5.735 GHz-5850 GHz) 6032, anda B47 sub-band (5.855 GHz-5.925 GHz) 6033. These sub-bands can beconfigured alongside a UNII-1 band (5.15 GHz-5.25 GHz) 6034, a UNII-2Aband (5.25 GHz-5.33 GHz) 6035, a UNII-2C band (5.49 GHz-5.735 GHz) 6036,a UNII-3 band (5.725 GHz-5.835 GHz) 6037, and a UNII-4 band (5.85GHz-5.925 GHz) 6038. These bands can coexist with additional bandsconfigured following the third application band 6030 for otherapplications. Of course, there can be other variations, modifications,and alternatives.

In an embodiment, the present filter utilizes high purity piezoelectricXBAW technology as described in the previous figures. This filterprovides low insertion loss and meets the stringent rejectionrequirements enabling coexistence with n79 and U-NII-1/2A and U-NII-2C/3on the same antenna, as shown in FIG. 60 . The high-power ratingsatisfies the demanding power requirements of the latest Wi-Fi and 5Gstandards.

FIG. 61 is a simplified diagram illustrating an overview of key marketsthat are applications for acoustic wave RF triplexers according to anexample of the present invention. The application chart 6100 for BAW RFfilters shows mobile devices, smartphones, automobiles, Wi-Fi tri-bandrouters, tri-band mobile devices, tri-band smartphones, integrated cablemodems, Wi-Fi tri-band access points, LTE-U/LAA small cells, and thelike. A schematic representation of the frequency spectrum used in aWi-Fi/5G system is provided in FIG. 62 .

FIG. 62 is a simplified diagram illustrating application areas forWi-Fi/5G RF triplexers in mobile applications according to examples ofthe present invention. As shown, RF filters used by communicationdevices 6200 can be configured for specific applications at a specificband (or multiple bands) of operation. In a specific example, a mobileapplication area can be designated at three frequency ranges using thethree filters configured in the triplexer. The three pass-band frequencybands of the three filters can include the range between 4400 MHz and5000 MHz, the range between 5150 MHz and 5350 MHz, and the range between5470 MHz and 5855 MHz. In another example, the three pass-band frequencybands of the three filters can include the range between 4400 MHz and5000 MHz, the range between 5130 MHz and 5170 MHz, and the range between5470 and 5835 MHz.

Each filter covers one of these pass-bands and rejects frequenciesoutside of that specific band. In this example, the other frequencyranges (e.g., 600 MHz to 2700 MHz, 3300 MHz to 4200 MHz, 6000 MHz to9900 MHz) are rejected by all three filters of the triplexer. Using thistriplexer structure, each filter can be configured for a differentapplication. Those of ordinary skill in the art will recognize othervariations, modifications, and alternatives.

The present invention includes resonator and RF filter devices usingboth textured polycrystalline piezoelectric materials (deposited usingPVD methods) and single crystal piezoelectric materials (grown using CVDtechnique upon a seed substrate). Various substrates can be used forfabricating the acoustic devices, such silicon substrates of variouscrystallographic orientations and the like. Additionally, the presentmethod can use sapphire substrates, silicon carbide substrates, galliumnitride (GaN) bulk substrates, or aluminum nitride (AlN) bulksubstrates. The present method can also use GaN templates, AlNtemplates, and AlxGa1-xN templates (where x varies between 0.0 and 1.0).These substrates and templates can have polar, non-polar, or semi-polarcrystallographic orientations. Further the piezoelectric materialsdeposed on the substrate can include allows selected from at least oneof the following: AlN, AlN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN,ScAlGaN, ScGaN, ScN, BAlN, BAlScN, and BN.

The resonator and filter devices may employ process technologiesincluding but not limited to Solidly-Mounted Resonator (SMR), Film BulkAcoustic Resonator (FBAR), or XBAW technology. Representativecross-sections are shown below in FIGS. 63A-63C. For clarification, theterms “top” and “bottom” used in the present specification are notgenerally terms in reference of a direction of gravity. Rather, theterms “top” and “bottom” are used in reference to each other in thecontext of the present device and related circuits. Those of ordinaryskill in the art will recognize other variations, modifications, andalternatives.

In an example, the piezoelectric layer ranges between 0.1 and 2.0 um andis optimized to produced optimal combination of resistive and acousticlosses. The thickness of the top and bottom electrodes range between 250Å and 2500 Å and the metal consists of a refractory metal with highacoustic velocity and low resistivity. The resonators are “passivated”with a dielectric (not shown in FIGS. 63A-63C) consisting of a nitrideand or an oxide and whose range is between 100 Å and 2000 Å. Thedielectric layer is used to adjust resonator resonance frequency. Extracare is taken to reduce the metal resistivity between adjacentresonators on a metal layer called the interconnect metal. The thicknessof the interconnect metal ranges between 500 Å and 5 um. The resonatorscontain at least one air cavity interface in the case of SMRs and twoair cavity interfaces in the case of FBARs and XBAWs. The shape of theresonators selected come from asymmetrical shapes including ellipses,rectangles, and polygons. Further, the resonators contain reflectingfeatures near the resonator edge on one or both sides of the resonator.

FIGS. 63A-63C are simplified diagrams illustrating cross-sectional viewsof resonator devices according to various examples of the presentinvention. More particularly, device 6301 of FIG. 63A shows a BAWresonator device including an SMR, FIG. 63B shows a BAW resonator deviceincluding an FBAR, and FIG. 63C shows a BAW resonator device with asingle crystal XBAW. As shown in SMR device 6301, a reflector device6320 is configured overlying a substrate member 6310. The reflectordevice 6320 can be a Bragg reflector or the like. A bottom electrode6330 is configured overlying the reflector device 6320. Apolycrystalline piezoelectric layer 6340 is configured overlying thebottom electrode 6330. Further, a top electrode 6350 is configuredoverlying the polycrystalline layer 6340. As shown in the FBAR device6302, the layered structure including the bottom electrode 6330, thepolycrystalline layer 6340, and the top electrode 6350 remains the same.The substrate member 6311 includes an air cavity 6312, and a dielectriclayer is formed overlying the substrate member 6311 and covering the aircavity 6312. As shown in XBAW device 6303, the substrate member 6311also contains an air cavity 6312, but the bottom electrode 6330 isformed within a region of the air cavity 6312. A single crystalpiezoelectric layer is formed overlying the substrate member 6311, theair cavity 6312, and the bottom electrode 6341. Further, a top electrode6350 is formed overlying a portion of the single crystal layer 6341.These resonators can be scaled and configured into circuitconfigurations shown in FIGS. 64A-64C.

The RF filter circuit can comprise various circuit topologies, includingmodified lattice (“I”) 6401, lattice (“II”) 6402, and ladder (“III”)6403 circuit configurations, as shown in FIGS. 64A, 64B, and 64C,respectively. These figures are representative lattice and ladderdiagrams for acoustic filter designs including resonators and otherpassive components. The lattice and modified lattice configurationsinclude differential input ports 6410 and differential output ports6450, while the ladder configuration includes a single-ended input port6411 and a single-ended output port 6450. In the lattice configurations,nodes are denoted by top nodes (t1-t3) and bottom nodes (b1-b3), whilein the ladder configuration the nodes are denoted as one set of nodes(n1-n4). The series resonator elements (in cases I, II, and III) areshown with white center elements 6421-6424 and the shunt resonatorelements have darkened center circuit elements 6431-6434. The serieselements resonance frequency is higher than the shunt elements resonancefrequency in order to form the filter skirt at the pass-band frequency.The inductors 6441-6443 shown in the modified lattice circuit diagram(FIG. 64A) and any other matching elements can be included eitheron-chip (in proximity to the resonator elements) or off-chip (nearby tothe resonator chip) and can be used to adjust frequency pass-band and/ormatching of impedance (to achieve the return loss specification) for thefilter circuit. The filter circuit contains resonators with at least tworesonance frequencies. The center of the pass-band frequency can beadjusted by a trimming step (using an ion milling technique or otherlike technique) and the shape the filter skirt can be adjusted bytrimming individual resonator elements (to vary the resonance frequencyof one or more elements) in the circuit.

In an example, the present invention provides an RF filter circuitdevice in a ladder configuration. The device can include an input port,a first node coupled to the input port, a first resonator coupledbetween the first node and the input port. A second node is coupled tothe first node and a second resonator is coupled between the first nodeand the second node. A third node is coupled to the second node and athird resonator is coupled between the second node and the third node. Afourth node is coupled to the third node and a fourth resonator iscoupled between the third node and the output port. Further, an outputport is coupled to the fourth node. Those of ordinary skill in the artwill recognize other variations, modifications, and alternatives.

Each of the first, second, third, and fourth resonators can include acapacitor device. Each such capacitor device can include a substratemember, which has a cavity region and an upper surface region contiguouswith an opening in the first cavity region. Each capacitor device caninclude a bottom electrode within a portion of the cavity region and apiezoelectric material overlying the upper surface region and the bottomelectrode. Also, each capacitor device can include a top electrodeoverlying the single crystal material and the bottom electrode, as wellas an insulating material overlying the top electrode and configuredwith a thickness to tune the resonator.

The device also includes a serial configuration includes the input port,the first node, the first resonator, the second node, the secondresonator, the third node, the third resonator, the fourth resonator,the fourth node, and the output port. A separate shunt configurationresonator is coupled to each of the first, second, third, fourth nodes.A parallel configuration includes the first, second, third, and fourthshunt configuration resonators. Further, a triplexer circuit responsecan be configured between the input port and the output port andconfigured from the serial configuration and the parallel configurationto achieve a transmission loss from three pass-bands collectively havinga characteristic frequency centered around 5.1275 GHz and having acollective bandwidth from 4.400 GHz to 5.855 GHz such that thecharacteristic frequency centered around 5.1275 GHz is tuned from alower frequency ranging from about 4.0 GHz to 5.5 GHz.

In a specific example, the first, second, third, and fourthpiezoelectric materials are each essentially a single crystal aluminumnitride bearing material or aluminum scandium nitride bearing material,a single crystal gallium nitride bearing material or gallium aluminumbearing material, or the like. In another specific embodiment, thesepiezoelectric materials each comprise a polycrystalline aluminum nitridebearing material or aluminum scandium bearing material, or apolycrystalline gallium nitride bearing material or gallium aluminumbearing material, or the like.

In a specific example, the serial configuration forms a resonanceprofile and an anti-resonance profile. The parallel configuration alsoforms a resonance profile and an anti-resonance profile. These profilesare such that the resonance profile from the serial configuration isoff-set with the anti-resonance profile of the parallel configuration toform the pass-band.

In a specific example, the three pass-bands include a first band rangingfrom about 4.400 GHz to 5.000 GHz, a second band ranging from about5.150 GHz to about 5.350 GHz, and a third band ranging from about 5.470GHz to 5.855 GHz. In another example, the three pass-bands include afirst band ranging from about 4400 MHz to 5000 MHz centered around 4700MHz, a second band ranging from about 5170 MHz to about 5330 MHzcentered around 5235 MHz, and a third band ranging from about 5470 MHzto 5835 MHz centered around 5665 MHz. The pass-band is characterized bya band edge on each side of the pass-band and having an amplitudedifference ranging from 10 dB to 60 dB. The pass-band has a pair of bandedges; each of which has a transition region from the pass-band to astop band such that the transition region is no greater than 250 MHz. Inanother example, pass-band can include a pair of band edges and each ofthese band edges can have a transition region from the pass-band to astop band such that the transition region ranges from 5 MHz to 250 MHz.

In a specific example, each of the first, second, third, and fourthinsulating materials comprises a silicon nitride bearing material or anoxide bearing material configured with a silicon nitride material anoxide bearing material.

In a specific example, the present device can further include severalfeatures. The device can further include one or more rejection bandsrejecting signals below 4.400 GHz and above 5.855 GHz. The device canfurther include an insertion loss of less than 2.0 dB and an amplitudevariation characterizing the pass-band of 0.8 dB. Also, the device caninclude an attenuation of up to 35 dB for a frequency range of 1800 MHzto 2400 MHz associated with each of the three pass-bands; an attenuationof up to 40 dB for a frequency range of 3300 MHz to 4200 MHz associatedwith each of the three-pass bands; an attenuation of up to 45 dB for afrequency range of 5170 MHz to 5835 MHz associated with the first andthird bands; and an attenuation of up to 45 dB for a frequency range of5490 MHz to 5835 MHz associated with the second band; an attenuation ofup to 30 dB for a frequency range of 6000 MHz to 8500 MHz associatedwith the first band, an attenuation of up to 30 dB for a frequency rangeof 6000 MHZ to 8800 MHz associated with the second band, and anattenuation of up to 30 dB for a frequency range of 6000 MHz to 9500 MHzassociated with the third band; and an attenuation of up to 35 dB for afrequency range of 8800 MHz to 10000 MHz associated with the first band,an attenuation of up to 35 dB for a frequency range of 10300 MHz to11000 MHz, and an attenuation of up to 35 dB for a frequency range of11000 to 12000 MHz associated with the third band. The device canfurther include a return loss characterizing the pass-band of up to 12dB and the device can be operable from −30 Degrees Celsius to 85 DegreesCelsius. The device can further include a maximum power within thepass-band of +30 dBm or 1 Watt, when driven by a signal whosecharacteristic contains a peak-to-average (PAR) signal of 9 dB. Further,the pass-band can be configured for 5.0 GHz Wi-Fi and 5G applications.

In a specific example, the present device can be configured as a bulkacoustic wave (BAW) filter device. Each of the first, second, third, andfourth resonators can be a BAW resonator. Similarly, each of the first,second, third, and fourth shunt resonators can be BAW resonators. Thepresent device can further include one or more additional resonatordevices numbered from N to M, where N is four and M is twenty.Similarly, the present device can further include one or more additionalshunt resonator devices numbered from N to M, where N is four and M istwenty.

In an example, the present invention provides an RF circuit device in alattice configuration. The device can include a differential input port,a top serial configuration, a bottom serial configuration, a firstlattice configuration, a second lattice configuration, and adifferential output port. The top serial configuration can include afirst top node, a second top node, and a third top node. A first topresonator can be coupled between the first top node and the second topnode, while a second top resonator can be coupled between the second topnode and the third top node. Similarly, the bottom serial configurationcan include a first bottom node, a second bottom node, and a thirdbottom node. A first bottom resonator can be coupled between the firstbottom node and the second bottom node, while a second bottom resonatorcan be coupled between the second bottom node and the third bottom node.

In an example, the first lattice configuration includes a first shuntresonator cross-coupled with a second shunt resonator and coupledbetween the first top resonator of the top serial configuration and thefirst bottom resonator of the bottom serial configuration. Similarly,the second lattice configuration can include a first shunt resonatorcross-coupled with a second shunt resonator and coupled between thesecond top resonator of the top serial configuration and the secondbottom resonator of the bottom serial configuration. The top serialconfiguration and the bottom serial configuration can each be coupled toboth the differential input port and the differential output port.

In a specific example, the device further includes a first balun coupledto the differential input port and a second balun coupled to thedifferential output port. The device can further include an inductordevice coupled between the differential input and output ports. In aspecific example, the device can further include a first inductor devicecoupled between the first top node of the top serial configuration andthe first bottom node of the bottom serial configuration; a secondinductor device coupled between the second top node of the top serialconfiguration and the second bottom node of the bottom serialconfiguration; and a third inductor device coupled between the third topnode of the top serial configuration and the third bottom node of thebottom serial configuration.

The packaging approach includes but is not limited to wafer levelpackaging (WLP), WLP-plus-cap wafer approach, flip-chip, chip and bondwire, as shown in FIGS. 65 and 66 . One or more RF filter chips and oneor more filter bands can be packaged within the same housingconfiguration. Each RF filter band within the package can include one ormore resonator filter chips and passive elements (capacitors, inductors)can be used to tailor the bandwidth and frequency spectrumcharacteristic. For a 5G-Wi-Fi system application, a packageconfiguration including 5 RF filter bands, including the n77, n78, n79,U-NII-1/2A and a U-NII-2C/3 bandpass solutions, is capable of beingaddressed with the BAW RF filter technology. For a Tri-Band Wi-Fi systemapplication, a package configuration including 3 RF filter bands,including the 2.4-2.5 GHz, 5.17-5.33 GHz and 5.49-5.85 GHz bandpasssolutions is capable of using BAW RF filter technology as well. The2.4-2.5 GHz filter solution can be either surface acoustic wave (SAW) orBAW resonators, whereas the 5.17-5.33 GHz and 5.49-5.85 GHz bands arelikely BAW resonators given the high frequency capability of BAWtechnology.

FIG. 65A is a simplified diagram illustrating a packing approachaccording to an example of the present invention. As shown, device 6501is packaged using a conventional die bond of an RF filter die 6510 tothe base 6520 of a package and metal bond wires 6530 to the RF filterchip from the circuit interface 6540.

FIG. 65B is as simplified diagram illustrating a packing approachaccording to an example of the present invention. As shown, device 6602is packaged using a flip-mount wafer level package (WLP) showing the RFfilter silicon die 6510 mounted to the circuit interface 6540 usingcopper pillars 6531 or other high-conductivity interconnects.

FIGS. 66A and 66B are simplified diagrams illustrating packingapproaches according to various examples of the present invention. InFIG. 66A, device 6601 shows an alternate version of a WLP utilizing aBAW RF filter circuit MEMS device 6631 and a substrate 6611 to a capwafer 6641. In an example, the cap wafer 6641 may includethru-silicon-vias (TSVs) to electrically connect the RF filter MEMSdevice 6631 to the topside of the cap wafer (not shown in the figure).The cap wafer 6641 can be coupled to a dielectric layer 6621 overlyingthe substrate 6611 and sealed by sealing material 6651.

In FIG. 66B, device 6602 shows another version of a WLP bonding aprocessed BAW substrate 6612 to a cap layer 6642. As discussedpreviously, the cap wafer 6642 may include thru-silicon vias (TSVs) 6632spatially configured through a dielectric layer 6622 to electricallyconnect the BAW resonator within the BAW substrate 6612 to the topsideof the cap wafer. Similar to the device of FIG. 66A, the cap wafer 6642can be coupled to a dielectric layer overlying the BAW substrate 6612and sealed by sealing material 6652. Of course, there can be othervariations, modifications, and alternatives.

In an example, the present triplexer passes frequencies in the ranges of4.4-5 GHz, 5.17-5.33 GHz, and 5.49 to 5.835 GHz, and rejects frequenciesoutside of this pass-band. Additional features of the Wi-Fi/5G triplexeracoustic wave filter circuit are provided below. The circuit symbolwhich is used to reference the RF filter building block is provided inFIG. 67 . The electrical performance specifications of the 5.5 GHzfilter are provided in FIG. 68 and the passband performance of thefilter is provided in FIG. 69 .

In various examples, the present filter can have certain features. Thedie configuration can be less than 2 mm×2 mm×0.5 mm; in a specificexample, the die configuration is typically less than 1 mm×1 mm×0.2 mm.The packaged device has an ultra-small form factor, such as a 1.1 mm×0.9mm×0.3 mm for a WLP approach, shown in FIG. 66 . A larger form factor isavailable using a wire bond approach for higher power applications. In aspecific example, the device is configured with a single-ended 50-Ohmantenna, and transmitter/receiver (Tx/Rx) ports. The high rejection ofthe device enables coexistence with adjacent Wi-Fi UNII and 5G bands.The device is also be characterized by a high power rating (maximumgreater than +31 dBm), a low insertion loss pass-band filter with lessthan 2.5 dB transmission loss, and performance over a temperature rangefrom −40 degrees Celsius to +85 degrees Celsius. Further, in a specificexample, the device is RoHS (Restriction of Hazardous Substances)compliant and uses Pb-free (lead-free) packaging.

FIG. 67 is a simplified circuit diagram illustrating a 4-port BAWTriplexer circuit according to an example of the present invention. Asshown, circuit 6700 includes a first port (“Port 1”) 6711, a second port(“Port 2”) 6712, and a third port (“Port 3”) 6713. These port representsa connection from a transmitter (TX) or receiver (RX) to the Triplexer,shown by filters 6721-6723. The antenna port 6730 represents a filterconnection from the Triplexer 6721-6723 to an antenna (ANT).

FIG. 68 is a simplified table of filter parameters according to anexample of the present invention. As shown, table 6800 includeselectrical specifications for a 5G Wi-Fi Triplexer. The circuitparameters are provided along with the specification units, minimum,along with typical and maximum specification values.

FIG. 69A is a simplified graph representing insertion loss overfrequency according to an example of the present invention. As shown,graph 6901 represents a narrowband response 6911-6913 for a 5G Wi-FiTriplexer compared to a modeled response using a ladder RF filterconfiguration. The modeled curve is the transmission loss (s21)predicted from a linear simulation tool incorporating a non-linear, full3-dimensional (3D) electromagnetic (EM) simulation. The measured curveis the s21 measured from scattering parameters (s-parameters) taken froma network analyzer test system.

FIG. 69B is a simplified graph representing insertion loss overfrequency according to an example of the present invention. As shown,graph 6902 represents a wideband response 6921-6923 for a 5.5 GHz RFfilter compared to a modeled response using a ladder RF filterconfiguration. The modeled curve is the transmission loss (s21)predicted from a linear simulation tool incorporating non-linear, full3-dimensional (3D) electromagnetic (EM) simulation. The measured curveis the s21 measured from scattering parameters (s-parameters) taken froma network analyzer test system.

While the above is a full description of the specific embodiments,various modifications, alternative constructions and equivalents may beused. As an example, the packaged device can include any combination ofelements described above, as well as outside of the presentspecification. Therefore, the above description and illustrations shouldnot be taken as limiting the scope of the present invention which isdefined by the appended claims.

What is claimed is:
 1. An RF filter system, comprising: a plurality ofbulk acoustic wave resonators arranged in a circuit, the circuitincluding a serial configuration of resonators and a parallel shuntconfiguration of resonators, the circuit having a circuit responsecorresponding to the serial configuration and the parallel configurationof the plurality of bulk acoustic wave resonators, each of theresonators of the plurality of resonators comprising: a support memberincluding a surface, the support member including a multilayer reflectorstructure including two pairs of a low impedance material layer and ahigh impedance material layer when the material layers are compared toeach other; a first electrode including tungsten overlying themultilayer reflector structure; a piezoelectric film including aluminumscandium nitride overlapping the first electrode and overlying themultilayer reflector structure; a second electrode including tungstenoverlapping the piezoelectric film, overlapping the first electrode, andoverlying the multilayer reflector; and a passivation layer includingsilicon nitride overlying the second electrode; wherein, portions of thesurface of the support member of at least one resonator of the pluralityof bulk acoustic wave resonators define a cavity region and at least aportion of the first electrode of the at least one resonator is locatedwithin the cavity region defined by the surface of the support member;and the circuit response corresponding to the serial configuration andthe parallel configuration of the plurality of resonators has a passband having a bandwidth from 5.490 GHz to 5.835 GHz.
 2. The system ofclaim 1, the circuit having a circuit topology, wherein the serialconfiguration of resonators and the parallel shunt configuration ofresonators are arranged in a ladder circuit topology having an insertionloss of ≤2.0 dB.
 3. The system of claim 2, further comprising: at leastone resonator of the plurality of bulk acoustic wave resonatorsincluding at least one trimmed material layer such that the pass band ofthe circuit has a bandwidth from 5.490 GHz to 5.835 GHz, the at leastone trimmed material layer including at least one of the passivationlayer and the second electrode having a thickness sufficient to providethe pass band having a bandwidth from 5.490 GHz to 5.835 GHz.
 4. Thesystem of claim 3, wherein, the at least one resonator of the pluralityof bulk acoustic wave resonators including at least a portion of thefirst electrode located in the cavity region defined by the surface ofthe support member, and the at least one resonator of the plurality ofbulk acoustic wave resonators including at least one trimmed materiallayer, are the same resonator.
 5. The system of claim 1, furthercomprising: a mass loaded structure overlying the second electrode,wherein the passivation layer including silicon nitride overlies themass loaded structure.
 6. The system of claim 5, further comprising: atleast one resonator of the plurality of bulk acoustic wave resonatorsincluding: an electrode contact via through the piezoelectric film; anda top metal physically coupled to the first electrode through theelectrode contact via.
 7. An RF filter system, comprising: a pluralityof bulk acoustic wave resonators arranged in a circuit, the circuitincluding a serial configuration of resonators and a parallel shuntconfiguration of resonators, the circuit having a circuit responsecorresponding to the serial configuration and the parallel configurationof the plurality of bulk acoustic wave resonators, each of theresonators of the plurality of resonators comprising: a support memberincluding a surface, the support member including a multilayer reflectorstructure including two pairs of a low impedance material layer and ahigh impedance material layer when the material layers are compared toeach other; a first electrode including tungsten overlying themultilayer reflector structure; a piezoelectric film including aluminumscandium nitride overlapping the first electrode and overlying themultilayer reflector structure; a second electrode including tungstenoverlapping the piezoelectric film, overlapping the first electrode, andoverlying the multilayer reflector, a resonator area being defined by anarea where the second electrode, the piezoelectric film, and the firstelectrode overlap; a passivation layer including silicon nitrideoverlying the second electrode; wherein, portions of the surface of thesupport member of at least one resonator of the plurality of bulkacoustic wave resonators define a cavity region and at least a portionof the first electrode of the at least one resonator is located withinthe cavity region defined by the surface of the support member; and thecircuit response corresponding to the serial configuration and theparallel configuration of the plurality of resonators has a pass bandhaving a bandwidth from 5.490 GHz to 5.835 GHz; at least one resonatorof the plurality of bulk acoustic wave resonators includes at least onetrimmed material layer such that the pass band of the circuit has abandwidth from 5.490 to 5.835 GHz, wherein the at least one trimmedmaterial layer includes a first thickness in the resonator area that isthinner than a second thickness in another area of the same materiallayer such that the pass band of the circuit has a bandwidth from about5.490 to 5.835 GHz.
 8. The system of claim 7, wherein, the at least oneresonator of the plurality of bulk acoustic wave resonators including atleast a portion of the first electrode located within the cavity regiondefined by the surface of the support member, and the at least oneresonator of the plurality of bulk acoustic wave resonators including atleast one trimmed material layer, are the same resonator.
 9. The systemof claim 8, further comprising: a mass loaded structure overlying thesecond electrode, wherein the passivation layer including siliconnitride overlies the mass loaded structure.
 10. The system of claim 9,the circuit having a circuit topology, wherein the serial configurationof resonators and the parallel shunt configuration of resonators arearranged in a ladder circuit topology having an insertion loss of ≤2.0dB.
 11. The system of claim 10 further comprising: at least oneresonator of the plurality of bulk acoustic wave resonators arranged inthe circuit including: an electrode contact via through thepiezoelectric film; and a top metal physically coupled to the firstelectrode through the electrode contact via.
 12. The system of claim 1,a resonator area being defined by an area where the second electrode,the piezoelectric film, and the first electrode overlap, the systemfurther comprising: a mass loaded structure overlying the secondelectrode, wherein the mass loaded structure is located outside of theresonator area.
 13. The system of claim 12, wherein the mass loadedstructure surrounds the resonator area.
 14. The system of claim 12, thecircuit having a circuit topology, wherein the serial configuration ofresonators and the parallel shunt configuration of resonators arearranged in a ladder circuit topology having an insertion loss of ≤2.0dB.
 15. The system of claim 1, wherein the piezoelectric film includingaluminum scandium nitride is one of a single crystal material and apolycrystalline material.
 16. The system of claim 1, wherein the firstelectrode is located within the cavity region defined by the surface ofthe support member such that the surface of the support member iscontiguous with an upper surface of the first electrode.
 17. The systemof claim 1, wherein the support member includes a single material layer.18. The system of claim 7, wherein the support member includes a singlematerial layer.